Greater Noida (Uttar Pradesh) [India], March 20 (HBTV): Emphasizing that India must become self-reliant in chip production and is actively building a semiconductor ecosystem, Prime Minister Narendra Modi said it is a matter of pride that Uttar Pradesh is poised to emerge as a major centre for India’s semiconductor system.
The Prime Minister performed the groundbreaking ceremony for the HCL-Foxconn joint venture project, India Chip Pvt Ltd, at the Yamuna Expressway Industrial Development Authority (YEIDA) in Uttar Pradesh via video conferencing.
Speaking on the occasion, he said wherever a semiconductor unit is established, design centres emerge, startup ecosystems develop, and innovation accelerates. He also referred to the India AI Impact Summit, which concluded on Saturday.
'Today, India is rapidly progressing towards its goal of development. I have also said from the Red Fort that India has no time to pause or slow down. Since the beginning of 2026, India has accelerated its progress, and this week is also proving to be historic for India,' he said.
'Heads of state and technology leaders from across the world gathered in Delhi for the Global AI Impact Summit. At this summit, the world witnessed India’s AI potential, understood our vision, and appreciated it,' he added.
The Prime Minister said this decade is a 'tech-ade' for India.
'Whatever India is doing in the field of technology in this decade will become the basis of our strength in the 21st century. India may have started its journey in the semiconductor sector late, but today, we are progressing at a rapid pace. India has so far approved 10 semiconductor fabrication and packaging projects under its Semiconductor Mission. Four of these units are set to commence production very soon,' he said.
He further said that India is making unprecedented investments in every technology that will shape the future of humanity.
The establishment of the HCL-Foxconn semiconductor facility marks a significant milestone in India’s journey towards technological self-reliance and reflects the vision of positioning the country as a trusted global destination for high-end electronics and semiconductor manufacturing, according to a release.
This Outsourced Semiconductor Assembly and Test (OSAT) facility at YEIDA is being set up by India Chip Pvt Ltd under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP), with a total investment of over INR 3,700 crore. The project aligns with the government’s efforts to strengthen domestic manufacturing capabilities, reduce import dependence, and build resilient global supply chains. It is expected to support key sectors such as mobile phones, tablets, laptops, automotive, and consumer electronics.
Through this initiative, India’s semiconductor ecosystem is expected to receive a major boost, fostering innovation, skill development, and technology transfer, the release said.
The facility is also expected to generate thousands of direct and indirect employment opportunities for engineers, technicians, and professionals, while catalysing growth in ancillary industries.
The release said the HCL-Foxconn joint venture underscores India’s growing stature in the global semiconductor landscape and represents a major step towards building a robust and self-reliant electronics manufacturing ecosystem.
(ANI)